DARPA's 3DHI program installs its Texas foundry tooling

DARPA's $1.4B 3D Heterogeneous Integration program — anchored at a new Texas facility — completed its tool install in Q1 2026, part of the broader $1.5B / 5-year Electronics Resurgence Initiative. The program targets defense and commercial use cases for chiplet integration and is expected to start hosting open-IP designs (POSH, IDEA, MIT-LL's Common Evaluation Platform) once the line is qualified.